Method for fabricating fluid ejection device
AssigneeFunai Electric Co., Ltd.
InventorsDavid Bernard, Andrew McNees, James Mrvos
Life of this patent
Estimating the term…
Loading patent…
AssigneeFunai Electric Co., Ltd.
InventorsDavid Bernard, Andrew McNees, James Mrvos
Estimating the term…
Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.
A method for fabricating a fluid ejection device, the method comprising:
Dependencies are inferred from the claim text.