US 10,647,090 B2Granted

Display panel motherboard, method of manufacturing display panel, and display apparatus

AssigneesBoe Technology Group Co., Ltd., Ordos Yuansheng Optoelectronics Co., Ltd.

InventorsAng Xiao, Fuyi Cui, Fujiang Jin, Quanqin Sun, Xiangnan Wang

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Abstract

The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.

Claims17

Dependent claims

An OLED display panel motherboard, comprising a first substrate and a second substrate provided opposite to each other;

wherein,
the first substrate has a plurality of first zones and a plurality of second zones, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material patterns are formed between every two adjacent first packaging material patterns and on a side of the first packaging material pattern facing away from the first display region, respectively;
the second substrate has a second display region opposite to the first display region, the second substrate further has a plurality of heat dissipating layers and a plurality of structural supports on at least one side of each of the heat dissipating layers facing away from the second display region, positions of the plurality of heat dissipating layers correspond to positions of the plurality of first packaging material patterns on the first substrate, and positions of the plurality of structural supports correspond to positions of the plurality of second packaging material patterns on the first substrate;
and
both the first packaging material pattern and the second packaging material pattern are made of glass glue.

2 more elements

A method of manufacturing an OLED display panel, the method comprising:

forming, with a mask, packaging material patterns on a first substrate, the packaging material patterns comprising a plurality of first packaging material patterns and a plurality of second packaging material patterns between every two adjacent first packaging material patterns and on a side of each of the first packaging material patterns facing away from a first display region of the first substrate, respectively, each of the plurality of first packaging material patterns being on a periphery of the first display region;
gluing a second substrate to the first substrate formed with the packaging material patterns, to obtain an OLED display panel motherboard;
cutting regions of the OLED display panel motherboard where the plurality of second packaging material patterns on the at least one side of the each of the first packaging material patterns facing away from the first display region are located, to obtain a plurality of OLED display panels,
wherein, the gluing the second substrate to the first substrate formed with the packaging material patterns, to obtain the OLED display panel motherboard, comprises the following steps of:
forming, by one patterning process, a plurality of heat dissipating layers and a plurality of structural supports on at least one side of each of the heat dissipating layers facing away from a second display region of the second substrate, on the second substrate, positions of the plurality of heat dissipating layers corresponding to positions of the plurality of first packaging material patterns on the first substrate, positions of the plurality of structural supports corresponding to positions of the plurality of second packaging material patterns on the first substrate;
and
gluing the first substrate formed with the packaging material patterns to the second substrate formed with the plurality of heat dissipating layers and the plurality of structural supports, to obtain the OLED display panel motherboard;
and
wherein both the first packaging material and the second packaging material pattern are made of glass glue.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/576,268Filed 19 Apr 2017
Priority: CN 2016 1 024684420 Apr 2016
Published: US 2018/0147817 A131 May 2018
Granted: 12 May 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

B32B 17/06
Layered products essentially comprising sheet glass, or glass, slag, or like fibres: comprising glass as the main or only constituent of a layer,…
B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 37/12
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by using adhesives
B32B 38/0004
Ancillary operations in connection with laminating processes: cutting, tearing or severing, e.g. bursting; Cutter details