Method of forming electrical connections using optical triggering for solder

A method of interconnecting multiple components of an electrical assembly with a solder joint, comprising the steps of:

• positioning a first component adjacent to a second component to provide a connection area between the first and second components;
• dispensing a solid solder sphere to a capillary tube comprising a first portion, a second portion extending downwardly from first portion, and an exit orifice at a distal end of the second portion, wherein the capillary tube is positioned with the exit orifice above the connection area between the first and second components;
• applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube and until the measured light reaches a predetermined level;
• and
• applying a second laser to at least partially melt the solder sphere after the measured light decreases to the predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.