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US 10,646,917 B2Granted
Copper ingot, copper wire material, and method for producing copper ingot
AssigneeMitsubishi Materials Corporation
InventorsSatoru Mori, Eiho Watanabe
Life of this patent
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Abstract
A copper ingot of the present invention which is casted by a belt-caster type continuous casting apparatus includes: 1 ppm by mass or less of carbon; 10 ppm by mass or less of oxygen; 0.8 ppm by mass or less of hydrogen; 15 ppm by mass to 35 ppm by mass of phosphorus; and a balance of Cu and inevitable impurities, and includes inclusions formed of oxides containing carbon, phosphorus, and Cu.
Claims5
A copper ingot which is casted by a continuous casting rolling apparatus, the copper ingot comprising:
- 1 ppm by mass or less of carbon;
- 10 ppm by mass or less of oxygen;
- 0.8 ppm by mass or less of hydrogen;
- 15 ppm by mass to 35 ppm by mass of phosphorus;
- and
- a balance of Cu and inevitable impurities,
- wherein the copper ingot includes inclusions formed of oxides containing carbon, phosphorus, and Cu,
- wherein the electrical conductivity of the copper ingot is 98% IACS or more.
5 more elements
A copper wire material which is formed by processing a copper ingot,
- wherein the copper ingot which is casted by a continuous casting rolling apparatus, the copper ingot comprising:
- 1 ppm by mass or less of carbon;
- 10 ppm by mass or less of oxygen;
- 0.8 ppm by mass or less of hydrogen;
- 15 ppm by mass to 35 ppm by mass of phosphorus;
- and
- a balance of Cu and inevitable impurities,
- wherein the copper ingot includes inclusions formed of oxides containing carbon, phosphorus, and Cu,
- wherein the electrical conductivity of the copper ingot is 98% IACS or more.
6 more elements
Dependencies are inferred from the claim text.