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AssigneesSTMicroelectronics S.r.l., STMicroelectronics International N.V.
InventorsSimon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
Estimating the term…
The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
A method, comprising:
A microfluidic component, comprising:
A microfluidic component, comprising:
Dependencies are inferred from the claim text.