Back to results
US 10,641,672 B2Granted
Manufacturing catheter sensors
AssigneeSilicon Microstructures, Inc.
InventorsHolger Doering, Stephen C. Terry, Justin Gaynor, Omar Abed, Fernando Alfaro
Life of this patent
Estimating the term…
Abstract
Pressure sensors and associated structures that may facilitate the use of automated connection processes and tools. An example may provide structures for aligning interconnect wires to pressure sensor bondpads in order to facilitate the use of automated processes and tools.
Claims27
A pressure sensor system comprising:
- a pressure sensor having a plurality of bondpads, wherein the plurality of bondpads are coplanar;
- a plurality of wires, each having an exposed portion on at least one end of the wire:
- an alignment structure to align the plurality of wires such that the pitch of adjacent wires matches the pitch of adjacent bondpads in the plurality of bondpads, the alignment structure separate from the pressure sensor;
- a physical and electrical connection between a bondpad in the plurality of bondpads and an exposed portion of a wire in the plurality of wires;
- and
- an encapsulation material over the connected bondpad and the exposed portion of the wire, the encapsulation material providing electrical and environmental isolation of the connected bondpad from adjacent bondpads,
- wherein the alignment structure comprises spacers, and
- wherein the bondpads are unevenly spaced and a width of a first spacer between a first wire in the plurality of wires and a second wire in the plurality of wires is different than a width of a second spacer between the second wire in the plurality of wires and a third wire in the plurality of wires to compensate.
5 more elements
A pressure sensor system comprising:
- a pressure sensor having a plurality of bondpads, wherein the plurality of bondpads are coplanar;
- a plurality of wires, each having an exposed portion on at least one end of the wire:
- an alignment structure to align the plurality of wires, the alignment structure separate from the pressure sensor;
- a physical and electrical connection between a bondpad in the plurality of bondpads and an exposed portion of a wire in the plurality of wires;
- and
- an encapsulation material over the connected bondpad and the exposed portion of the wire, the encapsulation material providing electrical and environmental isolation of the connected bondpad from adjacent bondpads,
- wherein the alignment structure comprises a plurality of insulation layers, each insulation layer around a corresponding wire, the plurality of insulation layers having a thickness such that the pitch of adjacent wires matches the pitch of adjacent bondpads.
4 more elements
A pressure sensor system comprising:
- a pressure sensor having a plurality of bondpads, wherein the plurality of bondpads are coplanar;
- a plurality of wires, each having an exposed portion on at least one end of the wire;
- an alignment structure to align the plurality of wires, the alignment structure separate from the pressure sensor;
- a physical and electrical connection between a bondpad in the plurality of bondpads and an exposed portion of a wire in the plurality of wires;
- and
- an encapsulation material over the connected bondpad and the exposed portion of the wire, the encapsulation material providing electrical and environmental isolation of the connected bondpad from adjacent bondpads,
- wherein the alignment structure comprises a common insulation layer around each of the plurality of wires, where the common insulation layer has a thickness between adjacent wires in the plurality of wires such that the resulting pitch of adjacent wires matches the pitch of adjacent bondpads.
4 more elements
A pressure sensor system comprising:
- a pressure sensor having a plurality of bondpads, wherein the plurality of bondpads are coplanar;
- a plurality of wires, each having an exposed portion on at least one end of the wire:
- an alignment structure to align the plurality of wires such that the pitch of adjacent wires matches the pitch of adjacent bondpads in the plurality of bondpads, the alignment structure separate from the pressure sensor;
- a physical and electrical connection between a bondpad in the plurality of bondpads and an exposed portion of a wire in the plurality of wires;
- an encapsulation material over the connected bondpad and the exposed portion of the wire, the encapsulation material providing electrical and environmental isolation of the connected bondpad from adjacent bondpads;
- a device identifier;
- and
- a blocking structure between the plurality of bondpads and the device identifier.
5 more elements
Dependencies are inferred from the claim text.