Microelectromechanical system (MEMS) devices
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Devin Alexander Mourey, Michael W. Cumbie, Si-lam J. Choy
Life of this patent
Estimating the term…
Abstract
One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.
Claims20
A microelectromechanical systems (MEMS) device comprising:
- a number of silicon dies overmolded with an overmold material;
- a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor;
- and
- a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding silicon die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active areas of the number of silicon dies.
A method of forming a microelectromechanical systems (MEMS) device comprising:
- overmolding a number of dies with an overmold material to form a coplanar package, the dies comprising a number of electrically active devices;
- and
- forming a fan-out layer on the coplanar package to increase distances between a number of features of the dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices of the dies and cause a fluid to flow to the electrically active devices, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active devices of the number of dies.
A lab-on-chip system comprising:
- a plurality of silicon dies;
- a number of electrically active devices disposed on a first side of the silicon dies;
- an overmold material overmolded over all sides of the silicon dies other than the first side;
- a fan-out layer coupled to each of the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices;
- and
- an electrical redistribution layer (RDL) positioned between the fan-out layer and the silicon dies to electrically couple the electrically active devices to an external circuit;
- wherein the active devices further comprise a number of actuators and a number of sensors, the number of actuators to cause fluid introduced into the fluid channels to interact with number of sensors.
Dependencies are inferred from the claim text.