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US 10,634,498 B2Granted
Physical quantity sensor, electronic apparatus, and moving object
AssigneeSeiko Epson Corporation
InventorTsugio Ide
Life of this patent
Estimating the term…
Abstract
A physical quantity sensor includes: a base; an IC disposed on the base; an angular rate sensor and an acceleration sensor disposed on the IC; a first stress buffer layer disposed between the IC and the angular rate sensor; and a second stress buffer layer disposed between the IC and the acceleration sensor. The first and second stress buffer layers are disposed spaced apart from each other.
Claims20
A physical quantity sensor comprising:
- a base;
- a circuit element disposed on the base;
- a first physical quantity sensor element disposed over the base or the circuit element, and driven to vibrate;
- a second physical quantity sensor element disposed over the base or the circuit element;
- and
- a stress buffer layer interposed between (i) the first physical quantity sensor element or the second physical quantity sensor element, and (ii) the base or the circuit element, the stress buffer layer including:
- a first insulating layer formed directly on an upper surface of the base or the circuit element;
- a first wiring layer formed directly on an upper surface of the first insulating layer;
- a second insulating layer, a part of the second insulating layer being formed directly on an upper surface of the first insulating layer, another part of the second insulating layer being formed directly on an upper surface of the first wiring layer;
- and
- a second wiring layer formed directly on an upper surface of the second insulating layer, the first physical quantity sensor element or the second physical quantity sensor element being disposed above the second wiring layer in a layer stacking direction, the first wiring layer and the second wiring layer electrically connecting the first physical quantity sensor element or the second physical quantity sensor element with a terminal disposed on the base or the circuit element, wherein:
- when the stress buffer layer is interposed between (i) the first physical quantity sensor element and (ii) the base or the circuit element, a ground potential is applied to the first wiring layer that is spaced farther apart from the first physical quantity sensor element than the second wiring layer;
- and
- when the stress buffer layer is interposed between (i) the second physical quantity sensor element and (ii) the base or the circuit element, a ground potential is applied to the second wiring layer that is closer to the second physical quantity sensor element than the first wiring layer.
11 more elements
Dependencies are inferred from the claim text.