US 10,629,461 B2 · Apparatuses for bonding semiconductor chips

Abstract

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

Claims8

Dependent claims

A manufacturing method for manufacturing semiconductor devices, the method comprising:

loading first and second substrates in first and second loading members to first and second transfer rails formed in a first direction;
supplying a first wafer including first semiconductor chips on a first wafer supply unit spaced from the first and second transfer rails in a second direction different from the first direction;
bonding the first semiconductor chips on the first and second substrates using a bonding unit between the first wafer supply unit and the first and second transfer rails;
and
unloading the first and second substrates on the first and second transfer rails within first and second unloading members,
wherein,
the first loading member and the first unloading member make a first pair, the second loading member and the second unloading member make a second pair,
the first pair is adjacent to a first end of the first transfer rail, and
the second pair is adjacent to a first end of the second transfer rail.

6 more elements

Dependencies are inferred from the claim text.

Apparatuses for bonding semiconductor chips

Life of this patent

Apparatuses for bonding semiconductor chips

Life of this patent

Abstract

Claims8