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US 10,626,353 B2Granted
Cleaning formulations
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsEmil A. Kneer, Yasuo Sugishima
Life of this patent
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Abstract
This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, water soluble sulfones, and water soluble ethers; 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof; and 4) water.
Claims37
A cleaning composition, comprising:
- 1) hydroxylamine;
- 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, water soluble sulfones, and water soluble ethers;
- 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof;
- and
- 4) water;
- wherein the composition is free of a metal halide and an oxidizing agent.
3 more elements
A cleaning composition, comprising:
- 1) at least one redox agent;
- 2) two organic solvents;
- 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof;
- and
- 4) water;
- wherein the two organic solvents are each independently selected from the group consisting of hexylene glycol, diethylene glycol butyl ether, and sulfolane.
3 more elements
A cleaning composition, comprising:
- 1) at least one redox agent;
- 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, water soluble sulfones, and water soluble ethers;
- 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof;
- and
- 4) water;
- wherein the at least one boron-containing compound comprises a boronic acid of formula (I):
- R—B—(OH)2,
- in which R is C1-C10 alky or aryl.
5 more elements
A method, comprising:
- contacting a semiconductor substrate containing post etch residues or post ashing residues with a cleaning composition comprising:
- 1) at least one redox agent;
- 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, water soluble sulfones, and water soluble ethers;
- 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof;
- and
- 4) water;
- wherein the composition is free of a metal halide.
4 more elements
Dependencies are inferred from the claim text.