Package structure of display panel, connecting board, package method and display device
AssigneeBoe Technology Group Co., Ltd.
InventorBo Zhang
Life of this patent
Estimating the term…
Abstract
Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.
Claims18
A package structure of a display panel, comprising:
- a display panel, a chipset configured for controlling the display panel, and a connecting board, wherein
- the chipset is located above the display panel, and the connecting board is located between the chipset and the display panel;
- the connecting board comprises a connecting substrate and convex spots located on two sides of the connecting substrate, convex spots on a first side of the connecting substrate are electrically connected with the package pins of the respective chips in the chipset, and convex spots on a second side of the connecting substrate are electrically connected with the display panel;
- and the convex spots on the first side of the connecting substrate are electrically connected with the convex spots on the second side of the connecting substrate correspondingly, and a surface of the convex spots on the second side of the connecting substrate is of gold;
- the package pins of respective chips in the chipset are electrically connected with the display panel through the connecting board,
- wherein the connection board does not include any driving chip,
- a material of the package pin of the chip is different from a material of the convex spot of the connecting board,
- the second side of the connecting substrate faces the display panel and the first side of the connection substrate is opposite to the second side of the connecting substrate.
A connecting board, wherein, a surface of a convex spot on at least one side of the connecting board is of gold.
A package method of a display panel, comprising:
- electrically connecting a first side of an connecting board with package pins of respective chips in a chipset configured for controlling the display panel, by a reflow soldering process;
- and
- electrically connecting a second side of the connecting board with the display panel by a chip on glass packaging process, wherein, a surface of the convex spot on the second side of the connecting board is of gold, wherein
- the connecting board comprises a connecting substrate and convex spots located on two sides of the connecting substrate, convex spots on the first side of the connecting substrate are electrically connected with the package pins of the respective chips in the chipset, and convex spots on the second side of the connecting substrate are electrically connected with the display panel;
- and the convex spots on the first side of the connecting substrate are electrically connected with the convex spots on the second side of the connecting substrate correspondingly,
- wherein the connection board does not include any driving chip,
- a material of the package pin of the chip is different from a material of the convex spot of the connecting board,
- the second side of the connecting substrate faces the display panel and the first side of the connection substrate is opposite to the second side of the connecting substrate.
Dependencies are inferred from the claim text.