# US 10,611,937 B2 · Composition for adhesion, stacked structure using the same, and electronic device using the same

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- Number: US 10,611,937 B2
- Document ID: US10611937B2
- Status: Granted
- Kind: B2
- Application number: 15/933,630
- Filed: 2018-03-23
- Published: 2018-09-27
- Granted: 2020-04-07
- Earliest claimed: 2017-03-24
- Assignees: Samsung Electronics Co., Ltd.; Gaema Tech
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Minchul Lee; Namil Koo; Kyungrim Kim; Sun-Woo Park; Yongin Park; Min-Woo Lee; Wonhee Choe; Hun Rae Kim; Dong-Sel Kim; Zeeyoung Lee
- Web page: https://patentgrep.com/patent/US10611937B2

## CPC

- C08F 220/1804: {C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate}
- C08F 20/18: with acrylic or methacrylic acids
- C08J 3/246: {Intercrosslinking of at least two polymers}
- C08K 3/36: Silica
- C09J 133/06: of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J 133/08: Homopolymers or copolymers of acrylic acid esters
- C09J 183/10: Block or graft copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C09J151/08, C09J153/00)
- G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing}
- G06V 40/1329: {Protecting the fingerprint sensor against damage caused by the finger}
- H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC}
- C08F 220/1806: {C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate}
- C08F 220/1811: {C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate}
- C08F 2500/01: High molecular weight, e.g. >800,000 Da.
- C08K 2201/011: Nanostructured additives
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.

## Claims

### Claim 1

A composition for adhesion, comprising:
an acrylic resin, the acrylic resin having a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, the acrylic resin including a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2,
in Formula A1,
R11 is a hydroxyalkyl group of 1 to 6 carbon atoms, and
R21 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms,
in Formula A2,
R12 is an alkyl group of 1 to 6 carbon atoms, and
R22 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms; and
a silane compound, the silane compound having a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, the silane compound including a polymerization unit derived from a monomer represented by Formula B,
in Formula B,
R100, R101, and R102 are each independently an alkyl group of 1 to 6 carbon atoms,
R200 and R201 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms, and
L1 is a single bond or an alkyl group of 1 to 4 carbon atoms.

### Claim 2 (depends on 1)

The composition for adhesion of claim 1, wherein
the acrylic resin further includes at least one of a polymerization unit derived from a monomer represented by Formula A3 or a polymerization unit derived from a monomer represented by Formula A4,
in Formula A3,
R13 is a bicyclic alkyl group of 5 to 15 carbon atoms, and
R23 is hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms,
in Formula A4,
R14 is an alkyl group of 1 to 6 carbon atoms, and
R24 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms, and
R14 of Formula A4 is a different group from R11 of Formula A1.

### Claim 3 (depends on 2)

The composition for adhesion of claim 2, wherein
the acrylic resin is represented by Formula 3,
in Formula 3,
one of R11, R12, R13 or R14 is a hydroxyalkyl group of 1 to 6 carbon atoms,
an other one of R11, R12, R13 or R14 is an alkyl group of 1 to 6 carbon atoms,
a different one of R11, R12, R13 or R14 is a bicyclic alkyl group of 5 to 15 carbon atoms, and
a remaining one of R11, R12, R13 or R14 is an alkyl group of 1 to 6 carbon atoms,
R21, R22, R23 and R24 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms, and
m1, m2, m3, and m4 are each independently an integer in a range greater than or equal to 1 and less than or equal 2,000.

### Claim 4 (depends on 2)

The composition for adhesion of claim 2, wherein
R13 in Formula A3 is represented by Formula A5,
in Formula A5,
R1, R2, and R3 are each independently one of hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms, and
* is a part combined with O of Formula A3.

### Claim 5 (depends on 1)

The composition for adhesion of claim 1, wherein
the silane compound is represented by Formula 4,
in Formula 4,
R110, R111, R112, and R113 are each independently an alkyl group of 1 to 6 carbon atoms,
L1 is a single bond or an alkyl group of 1 to 4 carbon atoms, and
a is an integer of 1 to 6.

### Claim 6 (depends on 1)

The composition for adhesion of claim 1, further comprising:
silica nanoparticles.

### Claim 7 (depends on 6)

The composition for adhesion of claim 6, wherein
a weight ratio of the silane compound to the silica nanoparticles is from about 1:0.3 to about 1:3, and
a weight ratio of the acrylic resin to a total amount of the silane compound and the silica nanoparticles is from about 1:1 to about 1:9.

### Claim 8 (depends on 1)

The composition for adhesion of claim 1, wherein
the acrylic resin is represented by Formula 1,
in Formula 1,
R11 is a hydroxyalkyl group of 1 to 6 carbon atoms,
R12 is an alkyl group of 1 to 6 carbon atoms,
R21 and R22 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms, and
n1 and n2 are each independently an integer in a range greater than or equal to 1 and less than or equal 2,000.

### Claim 9

A composition for adhesion, comprising:
an acrylic resin, the acrylic resin including a polymerization unit represented by Formula 1,
in Formula 1,
R11 is a hydroxyalkyl group of 1 to 6 carbon atoms,
R12 is an alkyl group of 1 to 6 carbon atoms,
R21 and R22 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms, and
n1 and n2 are each independently an integer in a range greater than or equal to 1 and less than or equal 2,000; and
a silane compound represented by Formula 4,
in Formula 4,
R110, R111, R112, and R113 are each independently an alkyl group of 1 to 6 carbon atoms,
R200 and R201 are each independently one of hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms,
L1 is a single bond or an alkyl group of 1 to 4 carbon atoms, and
a is an integer of 1 to 6.

### Claim 10 (depends on 9)

The composition for adhesion of claim 9, wherein
the acrylic resin further includes at least one of a polymerization unit represented by Formula 2-1 or a polymerization unit represented by Formula 2-2,
in Formula 2-1,
R13 is a bicyclic alkyl group of 5 to 15 carbon atoms,
R23 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms, and
n3 is an integer in a range greater than or equal to 1 and less than or equal 2,000,
in Formula 2-2,
R14 is an alkyl group of 1 to 6 carbon atoms,
R24 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms, and
n4 is an integer in a range greater than or equal to 1 and less than or equal 2,000.

### Claim 11 (depends on 9)

The composition for adhesion of claim 9, further comprising:
silica nanoparticles.

### Claim 12 (depends on 1)

An electronic device, comprising:
a substrate;
a sensing film on the substrate; and
an adhesion layer on the sensing film, the adhesion layer including a cured product of the composition for adhesion according to claim 1.

### Claim 13 (depends on 12)

The electronic device of claim 12, further comprising:
a glass layer on the adhesion layer, wherein
the adhesion layer is in physical contact with the sensing film and the glass layer.

### Claim 14 (depends on 12)

The electronic device of claim 12, wherein
the acrylic resin further includes at least one of a polymerization unit derived from a monomer represented by Formula A3 or a polymerization unit derived from a monomer represented by Formula A4,
in Formula A3,
R13 is a bicyclic alkyl group of 5 to 15 carbon atoms, and
R23 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms,
in Formula A4,
R14 is an alkyl group of 1 to 6 carbon atoms, and
R24 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms.

### Claim 15 (depends on 14)

The electronic device of claim 14, wherein R13 in Formula A3 is isobornyl.

### Claim 16 (depends on 12)

The electronic device of claim 12, further comprising silica nanoparticles,
wherein a weight ratio of the silane compound to the silica nanoparticles range from about 1:0.3 to about 1:3, and
wherein a weight ratio of the acrylic resin to a total amount of the silane compound and the silica nanoparticles range from about 1:1 to about 1:9.

### Claim 17 (depends on 12)

The electronic device of claim 12, wherein the sensing film includes an insulating polymer.

### Claim 18 (depends on 12)

The electronic device of claim 12, further comprising:
a display device part between the substrate and the sensing film;
a first adhesion film between the substrate and the display device part; and
a second adhesion film between the display device part and the first adhesion film,
wherein at least one of the first adhesion film or the second adhesion film includes the cured product of the composition for adhesion.

### Claim 19 (depends on 9)

A stacked structure, comprising:
a substrate;
an organic layer on the substrate;
an inorganic layer on the organic layer; and
an adhesion layer between the organic layer and the inorganic layer, the adhesion layer include a cured product of a composition for adhesion according to claim 9.

### Claim 20 (depends on 10)

A stacked structure, comprising:
a substrate;
an organic layer on the substrate;
an inorganic layer on the organic layer; and
an adhesion layer between the organic layer and the inorganic layer, the adhesion layer includes a cured product of a composition for adhesion according to claim 10, wherein
R13 in Formula 2-1 is represented by Formula A5,
in Formula A5,
R1, R2, and R3 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms,
* is a part combined with O of Formula 2-1.