Epoxy resin composition with soda lime glass filler
AssigneeSolEpoxy, Inc.
InventorsDonald Arthur Burkhart, Robert Joseph Groele
Life of this patent
Estimating the term…
Abstract
Disclosed are compositions relating to optically clear epoxy resin formulations with filler compositions having superior regular transmission of light between 350 nm and 2500 nm, and a low coefficient of thermal expansion, along with optoelectronic devices sealed with the same.
Claims22
An encapsulant material comprising a cured compound, said cured compound comprising a reaction product of a partially-cured epoxy component having a soda lime glass filler material substantially uniformly distributed therethrough, wherein said cured compound is prepared by B-staging a partially cured mixture of said epoxy component and said soda lime glass filler material;
- and wherein the cured compound comprises a coefficient of thermal expansion (CTE) equal to or less than 45 ppm/° C., as measured between a temperature range between 100°−120° C., and a regular transmission of light (RTRAN) in the range of 30% to 83% over light wavelengths from 350 nm to 2500 nm when measured in a 1.0 mm thick sample of said cured compound.
A method of making an encapsulant material comprising the steps of (1) preparing an epoxy resin component comprising an average index of refraction of about 1.50-1.52 when measured over a wavelength range of 350 nm to 2500 nm;
- (2) uniformly mixing in a soda lime glass filler with an average index of refraction of 1.50-1.52 when measured over a wavelength range of 350 nm to 2500 nm to form a filled, curable encapsulant composition;
- (3) encapsulating a device with the filled, curable encapsulant composition;
- and (4) curing the filled encapsulant composition with time or heat to produce a cured component, wherein the cured component comprises a coefficient of thermal expansion (CTE) equal to or less than 45 ppm/° C., as measured between a temperature range between 100°-120° C., an average index of refraction of 1.50-1.52 when measured over a wavelength range of 350 nm to 2500 nm, and a regular transmission of light (RTRAN) in the range of 30% to 83% over light wavelengths from 350 nm to 2500 nm when measured in a 1.0 mm thick sample of said cured component.
A cured composition comprising:
- an epoxy component comprising the reaction product of at least one base epoxy resin and at least one curing agent, wherein the epoxy component has an average index of refraction of 1.50 to 1.52 when measured over a wavelength range of 350 nm to 2500 nm,
- and an inorganic filler material comprising a first component with the highest weight percent content of the inorganic filler material and a second component with the second highest weight percent content of the inorganic filler material, wherein the first component is silica and the second component is soda ash, and said inorganic filler being substantially free of boron;
- wherein the cured composition comprises a coefficient of thermal expansion (CTE) of equal to or less than 30 ppm/° C., as measured between a temperature range between 100°−120° C., a glass transition temperature in the range of 120° C. to 180° C., and a regular transmission of light (RTRAN) in the range of 30%-83% over light wavelengths from 350 nm to 2500 nm when measured in a 1.0 mm thick sample of said cured composition.
Dependencies are inferred from the claim text.