Aqueous bonding composition

Abstract

Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.

Dependencies are inferred from the claim text.