Micro device transfer head heater assembly and method of transferring a micro device
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Claims18
A bipolar transfer head comprising:
- a base substrate;
- a pair of mesa structures protruding away from the base substrate, wherein the mesa structures are separated by a trench, and each mesa structure includes a top surface;
- a dielectric layer covering the top surfaces of the pair of mesa structures;
- and
- a top contact surface of the bipolar transfer head;
- wherein the top contact surface has x-y dimensions, each x dimension and y dimension of 1 to 100 μm.
A bipolar transfer head array comprising:
- a base substrate;
- an array of bipolar transfer heads, wherein each bipolar transfer head includes a pair of mesa structures protruding away from the base substrate, the mesa structures in each pair are separated by a trench, and each mesa structure includes a top surface;
- a dielectric layer covering the top surfaces of the mesa structures for the array of bipolar transfer heads;
- and
- each respective bipolar transfer head includes a respective top contact surface;
- wherein the top contact surface for each respective bipolar transfer head has x-y dimensions, each x dimension and y dimension of 1 to 100 μm.
Dependencies are inferred from the claim text.