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US 10,605,684 B2Granted
Multi-transducer modulus, electronic apparatus including the multi-transducer modulus and method for manufacturing the multi-transducer modulus
AssigneeSTMicroelectronics S.r.l.
InventorsAlex Gritti, Marco Omar Ghidoni
Life of this patent
Estimating the term…
Abstract
A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.
Claims23
A transducer modulus, comprising:
- a supporting substrate;
- a cap coupled to the supporting substrate, the cap and the supporting structure defining a chamber;
- a stack in the chamber, the stack including:
- a pressure transducer having a first sensitive element configured to detect an environmental pressure and generate a first transduced signal as a function of the environmental pressure detected;
- and
- an acoustic transducer coupled to the pressure transducer, the acoustic transducer having a second sensitive element configured to detect a sound wave and generate a second transduced signal as a function of the sound wave detected, wherein the first sensitive element of the pressure transducer and the second sensitive element of the acoustic transducer are stacked vertically with respect to each other;
- a layer of adhesive material that forms a fluid-tight region between the pressure transducer and the acoustic transducer;
- and
- a processing chip housed at least in part in the chamber, the processing chip operatively coupled to the pressure transducer and to the acoustic transducer and configured to receive the first and second transduced signals.
6 more elements
A transducer modulus comprising:
- a supporting substrate having a first through opening;
- a cap coupled to the supporting substrate, the cap including a second through opening, the cap and the supporting structure defining a first chamber, the second through opening being in fluid communication with the first chamber;
- a stack in the chamber covering the first through opening, the stack including:
- a pressure transducer having a first sensitive element configured to detect an environmental pressure and generate a first transduced signal as a function of the environmental pressure detected;
- and
- an acoustic transducer coupled to the pressure transducer, the acoustic transducer having a second sensitive element configured to detect a sound wave and generate a second transduced signal as a function of the sound wave detected, wherein the pressure transducer is coupled to the acoustic transducer by at least one coupling layer of glue having a thickness between 30 μm and 100 μm;
- and
- a processing chip housed at least in part in the chamber, the processing chip operatively coupled to the pressure transducer and to the acoustic transducer and configured to receive the first and second transduced signals.
5 more elements
An electronic apparatus, comprising:
- a microprocessor;
- and
- a transducer modulus coupled to the microprocessor, the transducer modulus including:
- a substrate;
- a cap coupled to the substrate and forming an inner chamber;
- a pressure transducer and an acoustic transducer in the chamber and coupled to each other in vertically-stacked manner and forming an internal chamber, the pressure transducer having a first sensitive element configured to detect an environmental pressure and generate a first transduced signal as a function of the environmental pressure detected, the acoustic transducer having a second sensitive element configured to detect a sound wave and generate a second transduced signal as a function of the sound wave detected, wherein the pressure transducer includes a through opening that places the internal chamber in fluid communication with the inner chamber;
- and
- a processing chip located at least partially in the chamber, the processing chip operatively coupled to the pressure transducer and to the acoustic transducer, the processing chip being configured to receive the first and second transduced signals.
5 more elements
A method, comprising:
- vertically stacking a pressure transducer and an acoustic transducer together on a supporting substrate;
- coupling a processing chip on the supporting substrate;
- operatively coupling the processing chip to the pressure transducer and to the acoustic transducer;
- and
- coupling a cap to the supporting substrate and defining a chamber that houses the stacked pressure transducer and the acoustic transducer and, at least in part, the processing chip.
2 more elements
Dependencies are inferred from the claim text.