Method for producing conductive film, conductive film, and touch panel
AssigneeFUJIFILM Corporation
InventorsKensuke Katagiri, Shin Tajiri
Life of this patent
Estimating the term…
Abstract
A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.
Claims10
A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate, the method comprising:
- a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from the water-insoluble polymer X and the water-insoluble polymer Y;
- a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y;
- and
- a third step of forming the conductive layer by removing the water-soluble polymer Z.
A conductive film comprising a substrate and a conductive layer that is disposed on the substrate and includes a metal component,
- wherein the conductive layer includes a polymer W formed as a result of a reaction between a water-insoluble polymer X having a cross-linking group and a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group,
- in the conductive layer, an average area fraction of the metal component is 85% or more in a metal-containing region, and
- in a vertical section of the conductive layer, the metal-containing region is a region extending from a middle position between an upper end position and a lower end position toward the substrate side by 50 nm and toward a surface X side by 50 nm;
- when a contour along a profile of the surface X of the conductive layer is moved from the surface X being a surface on a side opposite to the substrate side toward the substrate side, a position where the contour reaches the metal component included in the conductive layer is the upper end position;
- and when the contour is moved from the upper end position toward the substrate side, a position where the metal component ceases to exist in the conductive layer is the lower end position.
Dependencies are inferred from the claim text.