Process for molding a thermosetting resin

A method of molding a thermosetting resin, comprising, during a first stage:

• filling a first mold with a first thermosetting resin while causing the temperature of the first thermosetting resin to vary in compliance with a first temperature program, without exceeding a glass transition temperature Tg of the first thermosetting resin;
• and
• after the first mold has been filled, putting the first thermosetting resin under pressure while causing the temperature of the first thermosetting resin to vary in compliance with a second temperature program, without exceeding the glass transition temperature Tg of the first thermosetting resin, and detecting a drop in the pressure exerted by the first thermosetting resin on the first mold by identifying an instant t1 when the pressure presents a break of slope over time;
• and
• in a second stage:
• filling a second mold with a second thermosetting resin that includes a same material as the first thermosetting resin, while causing the temperature of the second thermosetting resin to vary in compliance with the first temperature program;
• and
• after the second mold has been filled, putting the second thermosetting resin under pressure while causing the temperature of the second thermosetting resin to vary in compliance with the second temperature program up to an instant t2 that lies in a time interval [t1−10 minutes (min), t1+10 min] or in a time interval [t1−(t1−t0)/2, t1+(t1−t0)/2], where t0 is a timing at which the first mold is filled with the first thermosetting resin, and then from the instant t2, increasing the temperature of the second thermosetting resin so as to exceed the glass transition temperature Tg of the second thermosetting resin.