Fuse element and fuse device
AssigneeDexerials Corporation
InventorsYoshihiro Yoneda, Chisato Komori, Kazutaka Furuta, Yasushi Utsunomiya
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Abstract
A fuse element capable of surface-mounting and capable of increased ratings while maintaining high-speed blowout property; and a fuse device using the same. A fuse element blown by self-generated heat caused when a rate-exceeding current flows therethrough constitutes a current path of a fuse device and has a low melting point metal layer and a high melting point metal layer laminated onto the low melting point metal layer; when the current flows therethrough, the low melting point metal layer erodes the high melting point metal layer and blowout occurs.
Claims46
A fuse element constituting a current path of a fuse device in which self-generated heat caused by a rate-exceeding current flowing therethrough causes blowout of the fuse element comprising:
- a low melting point metal layer;
- and
- a high melting point metal layer laminated onto the low melting point metal layer, the high melting point metal layer having a melting point higher than a melting point of the low melting point metal layer;
- wherein the fuse element is connected between two electrodes on an insulating substrate and connected onto the electrodes by a solder at a reflow temperature of the solder,
- wherein the fuse element has a laminated structure in which the low melting point metal layer is an inner layer and the high melting point metal layer is an outer layer laminated on an upper surface and on a lower surface of the low melting point metal layer, and
- wherein the melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C., and
- wherein the low melting point metal layer and the solder are melted at the reflow temperature of the solder.
A fuse device comprising:
- an insulating substrate;
- and
- a fuse element which is blown by self-generated heat when a rating-exceeding current flows therethrough mounted above the insulating substrate;
- wherein the fuse element comprises a low melting point metal layer and a high melting point metal layer laminated onto the low melting point metal layer, the high melting point metal layer having a melting point higher than a melting point of the low melting point metal layer,
- wherein the fuse element is connected between two electrodes on an insulating substrate and connected onto the electrodes by a solder at a reflow temperature of the solder,
- wherein the fuse element has a laminated structure in which the low melting point metal layer is an inner layer and the high melting point metal layer is an outer layer laminated on an upper surface and on a lower surface of the low melting point metal layer, and
- wherein the melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C., and
- wherein the low melting point metal layer and the solder are melted at the reflow temperature of the solder.
Dependencies are inferred from the claim text.