Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives

A method of assembling a hard disk drive electrical component and printed circuit substrate, wherein the method comprises:

• a) providing an integrated circuit component having a first major surface comprising one or more electrical interconnects;
• b) providing a printed circuit substrate having a first major surface comprising one or more electrical contacts, wherein the first major surface of the integrated circuit component faces the first major surface of the printed circuit substrate;
• c) physically and electrically coupling the one or more electrical interconnects to the one or more electrical contacts, wherein a space is formed between the integrated circuit component and the printed circuit substrate;
• d) dispensing an uncured encapsulant composition near the space between the integrated circuit component and the printed circuit substrate so that at least a portion of the uncured encapsulant composition flows into at least a portion of the space via capillary action, wherein the uncured encapsulant composition comprises:
• i) an uncured epoxy resin component;
• and
• ii) an inorganic filler particle component, wherein the inorganic filler particle component is present in an amount in the range from 30 to 80% by weight of the uncured encapsulant composition;
• and
• e) curing the encapsulant composition that is present in the space between the integrated circuit component and the printed circuit substrate, wherein the cured encapsulant composition has a Total Outgassing value of 1000 nanograms per gram or less of outgassed compounds of cured encapsulant composition according to Outgassing Test Procedure.