Methods, apparatus, and system for high-bandwidth on-mold antennas
AssigneeGlobalfoundries Inc.
InventorsSaquib Bin Halim, Md Sayed Kaysar Bin Rahim, Marcel Wieland
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Abstract
A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 μm to 1000 μm thick, such as from 750 μm to 800 μm thick, such as about 775 μm.
Claims17
A semiconductor device, comprising:
- a polymer layer comprising a first polymer surface and a second polymer surface;
- a mold comprising a first mold surface and a second mold surface, wherein the first mold surface is adjacent to the second polymer surface;
- a plurality of nodes disposed closer to the first polymer surface than to the second polymer surface;
- an antenna disposed on the second mold surface;
- and
- a first conductive element providing electrical communication between at least a first node and the antenna.
An apparatus, comprising:
- a plurality of semiconductor devices, wherein each semiconductor device comprises:
- a polymer layer comprising a first polymer surface and a second polymer surface;
- a mold comprising a first mold surface and a second mold surface, wherein the first mold surface is adjacent to the second polymer surface;
- a plurality of nodes disposed closer to the first polymer surface than to the second polymer surface;
- an antenna disposed on the second mold surface;
- and
- a first conductive element providing electrical communication between at least a first node and the antenna;
- wherein a first subset of the semiconductor devices is configured as a receiver antenna array and a second subset of the semiconductor devices is configured as a transmitter antenna array.
A method, comprising:
- forming a polymer layer comprising a first polymer surface and a second polymer surface;
- forming a mold comprising a first mold surface and a second mold surface, wherein the first mold surface is adjacent to the second polymer surface;
- forming a plurality of nodes disposed closer to the first polymer surface than to the second polymer surface;
- forming an antenna disposed on the second mold surface;
- and
- forming a first conductive element providing electrical communication between at least a first node and the antenna.
Dependencies are inferred from the claim text.