Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
AssigneeSkyworks Solutions, Inc.
InventorJames Phillip Young
Life of this patent
Estimating the term…
Abstract
Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
Claims17
A radio-frequency device comprising:
- a silicon die including a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the silicon die and each via lined with an electrical insulator;
- and
- a filter device mounted on the first side of the silicon die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in an active layer on the first side of the silicon die and at least some of the vias coupled with the radio-frequency circuit to facilitate an electrical connection between the radio-frequency circuit and mounting features on the second side of the silicon die, the radio-frequency circuit of the silicon die including a switch circuit.
A radio-frequency module comprising:
- a packaging substrate configured to receive a plurality of components;
- and
- a wafer level chip scale package mounted on the packaging substrate, the wafer level chip scale package having a silicon die that includes a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the silicon die and each via lined with an electrical insulator, the wafer level chip scale package further including a filter device mounted on the first side of the silicon die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in an active layer on the first side of the silicon die and at least some of the vias coupled with the radio-frequency circuit to facilitate an electrical connection between the radio-frequency circuit and mounting features on the second side of the silicon die, the radio-frequency circuit of the silicon die including a switch circuit.
A wireless device comprising:
- an antenna configured to receive a radio-frequency signal;
- a receiver in communication with the antenna, the receiver configured to process the received radio-frequency signal;
- and
- a radio-frequency module configured to route the received radio-frequency signal from the antenna to the receiver, the radio-frequency module including a wafer level chip scale package, the wafer level chip scale package having a silicon die that includes a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the silicon die and each via lined with an electrical insulator, the wafer level chip scale package further including a filter device mounted on the first side of the silicon die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in an active layer on the first side of the silicon die and at least some of the vias coupled with the radio-frequency circuit to facilitate an electrical connection between the radio-frequency circuit and mounting features on the second side of the silicon die, the radio-frequency circuit of the silicon die including a switch circuit.
Dependencies are inferred from the claim text.