Piezoelectric package-integrated delay lines

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• a cavity disposed within the package substrate, wherein the cavity is entirely enclosed within the plurality of organic dielectric layers of the package substrate;
• a first piezoelectric transducer positioned in proximity to a first end of the cavity, the first piezoelectric transducer to receive an input electrical signal and to generate an acoustic wave to be transmitted with a transmission medium;
• and
• a second piezoelectric transducer positioned in proximity to a second end of the cavity, the second piezoelectric transducer to receive the acoustic wave from the transmission medium and to generate an output electrical signal, wherein the transmission medium is positioned within the cavity of the organic substrate.

A computing device comprising:

• at least one processor to process data;
• a package substrate coupled to the at least one processor, the package substrate including a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes
• a cavity disposed within the package substrate, wherein the cavity is entirely enclosed within the plurality of organic dielectric layers of the package substrate;
• a first piezoelectric transducer positioned in proximity to a first end of a cavity of the package substrate, the first piezoelectric transducer to receive an input electrical signal and to generate an acoustic wave to be transmitted with a transmission medium;
• and
• a second piezoelectric transducer positioned in proximity to a second end of the cavity, the second piezoelectric transducer to receive the acoustic wave from the transmission medium and to generate an output electrical signal.