Inverter module having multiple half-bridge modules for a power converter of an electric vehicle

A method, comprising:

• providing a cold plate on a pick and place fixture, the cold plate having two shallow regions and a hump region, and the hump region disposed between the two shallow regions;
• dispensing a lubricant over a first surface of the cold plate;
• disposing a ceramic layer over the first surface of the cold plate;
• dispensing the lubricant over a first surface of the ceramic layer;
• installing a locator over the first surface of the ceramic layer;
• coupling a plurality of transistors within a plurality of slots formed in the locator using a plurality of clips and fasteners, each of the plurality of clips including at least two gull wings that extend out and over at least one of the plurality of transistors, and the plurality of fasteners coupling the plurality of clips to the locator;
• providing a capacitor over a first surface of the plurality of transistors;
• disposing a gel tray over the capacitor, the hump region of the cold plate is configured to raise the capacitor and the plurality of transistors into the gel tray;
• forming a positive input terminal on a first side surface of the half-bridge module;
• forming a negative input terminal on the first side surface of the half-bridge module, the positive input terminal positioned at a first level with respect to the first side surface and the negative input terminal positioned at a second, different level with respect to the first side surface;
• and
• coupling an output terminal on a second, different side surface of the half-bridge module.

A method, comprising:

• providing a half-bridge module, the half-bridge module comprising:
• a cold plate;
• a ceramic layer disposed over a first surface of the cold plate;
• a plurality of transistors disposed within slots of a locator, the locator and the plurality of transistors disposed over a first surface of the ceramic layer;
• a plurality of clips having gull wings that extend over the transistors to secure the plurality of transistors to the locator;
• a first plurality of fasteners disposed through the locator and cold plate to secure the plurality of clips to the locator;
• a first printed circuit board (PCB) disposed between the plurality of clips and the locator;
• a capacitor disposed over a first surface of the plurality of the transistors;
• a gel tray disposed over the capacitor, the first PCB and the plurality of transistors;
• a positive input terminal formed on a first side surface of the half-bridge module;
• a negative input terminal formed on the first side surface of the half-bridge module, the positive input terminal positioned at a first level with respect to the first side surface and the negative input terminal positioned at a second, different level with respect to the first side surface;
• and
• an output terminal formed on a second, different side surface of the half-bridge module.