Rectifier IC and insulation type switching power supply using the same

A semiconductor device comprising:

• a first conductive member;
• a second conductive member formed away from the first conductive member;
• a third conductive member formed away from the first and second conductive members;
• a first chip having a first surface and a second surface facing away from the first surface, with a first electrode formed on the first surface and a second electrode and a third electrode formed on the second surface, the first surface being electrically connected to the first conductive member;
• an insulating bonding member on the first conductive member;
• a second chip on the bonding member, the second chip having a fourth electrode, a fifth electrode, a sixth electrode, and a seventh electrode, the second chip being arranged to drive the first chip;
• a first wire connecting between the first conductive member and the fourth electrode on the second chip;
• a second wire connecting between the second conductive member and the fifth electrode on the second chip;
• a third wire connecting between the third conductive member and the sixth electrode on the second chip;
• a fourth wire connecting between the second electrode on the first chip and the seventh electrode on the second chip;
• a fifth wire connecting between the third electrode on the first chip and the second conductive member;
• and
• a sealing member covering part of the first conductive member, part of the second conductive member, part of the third conductive member, the first chip, the bonding member, the second chip, and the first, second, third, fourth, and fifth wires,
• wherein
• the first conductive member has a first part exposed through the sealing member;
• the second conductive member has a second part exposed through the sealing member;
• the third conductive member has a third part exposed through the sealing member;
• and
• a distance between the first and second parts is smaller than a distance between the second and third parts.