Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same

A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:

• a base material;
• a lower layer formed on the base material, the lower layer comprising an alloy of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
• an intermediate layer formed on the lower layer, without any intervening layer, the intermediate layer consisting of an alloy consisting of one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir, and one or two selected from a constituent element group C consisting of Sn and In;
• and
• an upper layer formed on the intermediate layer, the upper layer consisting of one selected from the constituent element group C,
• wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm;
• the thickness of the intermediate layer is 0.02 μm or more and less than 0.80 μm;
• and the thickness of the upper layer is 0.005 μm or more and less than 0.30 μm, and
• wherein the content of the metal(s) of the constituent element group A is 50% by mass or more in terms of the total content of Ni, Cr, Mn, Fe, Co and Cu in the lower layer, and the rest of the alloy in the lower layer consists of one or two or more selected from a group consisting of B, P, Sn and Zn.

A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:

• a base material;
• a lower layer formed on the base material, the lower layer consisting of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
• an intermediate layer formed on the lower layer, without any intervening layer, the intermediate layer comprising an alloy constituted with one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir;
• and
• an upper layer formed on the intermediate layer, the upper layer consisting of one selected from a constituent element group C consisting of Sn and In,
• wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm;
• the thickness of the intermediate layer is 0.02 μm or more and less than 0.80 μm;
• and the thickness of the upper layer is 0.005 μm or more and less than 0.30 μm, and
• wherein the content of the metal(s) of the constituent element group B is 50% by mass or more in terms of the total content of Ag, Au, Pt, Rh, Os and Ir in the intermediate layer, and the rest of the alloy in the intermediate layer consists of one or two or more selected from the group consisting of Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl and Zn.

A metallic material for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, the material comprising:

• a base material;
• a lower layer formed on the base material, the lower layer being consisting of one or two or more selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu;
• an intermediate layer formed on the lower layer, without any intervening layer, the intermediate layer consisting of an alloy consisting of one or two or more selected from a constituent element group B consisting of Ag, Au, Pt, Rh, Os and Ir, and one or two selected from a constituent element group C consisting of Sn and In;
• and
• an upper layer formed on the intermediate layer, the upper layer consisting of one selected from the constituent element group C,
• wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm;
• the thickness of the intermediate layer is 0.02 μm or more and less than 0.80 μm;
• and the thickness of the upper layer is 0.005 μm or more and less than 0.30 μm.