Solder component

A solder component to be subjected to surface-mount process on a substrate, the solder component comprising:

• one or more terminal members each of which has a bending portion bending in a direction crossing a surface of the substrate and which is connected to the surface of the substrate through the surface-mount process;
• and
• four or more substrate connection portions formed at end portions of the one or more terminal members,
• wherein three substrate connection portions out of the four or more substrate connection portions each have a width that is narrower than a width of the bending portion of the corresponding terminal member, and
• wherein, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions are in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each of the three substrate connection portions, a center of mass of the solder component is located inside a triangle determined by three contact points of the three substrate connection portions.