Wireless communications package with integrated antenna array

An antenna package, comprising:

• a multilayer package substrate comprising a plurality of antenna ground planes, a plurality of antenna feed lines, and a plurality of resistive transmission lines;
• and
• a package cover comprising a planar lid, wherein the planar lid comprises a planar antenna array patterned on a first surface of the planar lid, wherein the planar antenna array comprises an array of active antenna elements and a plurality of dummy antenna elements disposed on the first surface of the planar lid, wherein the plurality of dummy antenna elements are disposed in a perimeter region surrounding the array of active antenna elements;
• wherein the package cover is bonded to a first surface of the multilayer package substrate with the first surface of the planar lid facing the first surface of the multilayer package substrate, wherein each active antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the antenna feed lines, and wherein each dummy antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the resistive transmission lines;
• wherein the resistive transmission lines extend through the multilayer package substrate and comprise first end portions which are configured for electromagnetic coupling to corresponding ones of the dummy antenna elements, and second end portions which are grounded in a same metallization layer of the multilayer package substrate to thereby terminate radiation incident on the dummy antenna elements;
• and
• wherein the package cover is bonded to the multilayer package substrate with the first surface of the planar lid fixedly disposed at a distance from the first surface of the multilayer package substrate to provide an air space between the planar antenna array and the first surface of the multilayer package substrate.