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US 10,594,015 B2Granted
Dual purpose heat pipe and antenna apparatus
AssigneeIntel Corporation
InventorsPraveen Kumar, Bijendra Singh, Saku Lahti, Seppo Vesamaki, Marko Bonden
Life of this patent
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Abstract
A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.
Claims17
A heat pipe, comprising:
- a first conductive shell portion;
- a second conductive shell portion;
- an insulating shell portion disposed between the first conductive shell portion and the second conductive shell portion, wherein the insulating shell portion electrically insulates the first conductive shell portion from the second conductive shell portion;
- and
- a wick structure disposed in the first conductive shell portion, the second conductive shell portion, and the insulating shell portion.
2 more elements
A method, comprising:
- providing a heat pipe comprising:
- a first conductive shell portion;
- a second conductive shell portion;
- an insulating shell portion disposed between the first conductive shell portion and the second conductive shell portion, wherein the insulating shell portion electrically isolates the first conductive shell portion from the second conductive shell portion;
- and
- a wick structure disposed in the first conductive shell portion, the second conductive shell portion, and the insulating shell;
- and
- radiating radio frequency (RF) waves with the first conductive shell portion.
5 more elements
Dependencies are inferred from the claim text.