Electronic apparatus

An electronic apparatus comprising:

• a first substrate that includes a mounting surface;
• and
• a second substrate that includes a mounting surface, is mounted on the first substrate, and has a smaller area than the first substrate;
• wherein
• the second substrate extends in a longitudinal direction;
• the second substrate includes:
• a signal line;
• a high-frequency transmission line including the signal line;
• a plurality of input/output pads electrically connected to the signal line, on the mounting surface of the second substrate;
• and
• an auxiliary pad arranged between at least two input/output pads among the plurality of input/output pads on the mounting surface of the second substrate;
• the first substrate includes a plurality of lands provided on the mounting surface of the first substrate, each of the plurality of lands being respectively connected to a corresponding input/output pad or auxiliary pad;
• each of the input/output pad and the auxiliary pad is respectively soldered to a corresponding land on the mounting surface of the first substrate and the second substrate is surface-mounted on the first substrate in a state in which an entirety or substantially an entirety of the mounting surface of the second substrate faces the mounting surface of the first substrate;
• the second substrate further includes a bent portion that bends in a planar direction of the mounting surface of the first substrate;
• and
• the second substrate is arranged on the first substrate so as to avoid components mounted on the first substrate.