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US 10,593,967 B2Granted
Modulated thermal conductance thermal enclosure
AssigneeHoneywell International Inc.
InventorsSteven J. Eickhoff, Jeffrey Michael Klein
Life of this patent
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Abstract
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.
Claims15
A thermal insulation device comprising;
- a first plate;
- a second plate formed to nest adjacent the first plate with a gap between the first and second plates;
- a porous material disposed in the gap between the plates;
- a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient;
- and
- a vapor generating material disposed in the gap.
3 more elements
A thermal insulation enclosure comprising;
- a first plate;
- a second plate formed to nest adjacent the first plate with a gap between the first and second plates;
- a porous material disposed between the plates;
- a vapor generating material disposed in the gap;
- a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient;
- a duplicate set of first and second plates having a porous material, vapor generating aterial and sealing layer formed to mate with the first and second plates to form a chamber;
- and
- a device disposed within the chamber that is thermally insulated from ambient by the enclosure.
5 more elements
Dependencies are inferred from the claim text.