Encapsulation film
AssigneeLG Chem, Ltd.
InventorsJung Ok Moon, Hyun Jee Yoo, Hyun Suk Kim, Jung Woo Lee, Se Woo Yang
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Abstract
The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
Claims20
An encapsulation film for an organic electronic element, comprising:
- a metal layer having a first surface and a second surface opposite to the first surface;
- and
- an encapsulation layer provided on the first surface, positioned inside an edge of the first surface so that a gap having a size of 20 μm to 1,000 μm is formed between an edge of the encapsulation layer and the edge of the first surface, and having an inclined part at the edge of the encapsulation layer.
Dependencies are inferred from the claim text.