Electronic component having a reinforced hollowed structure
AssigneeMurata Manufacturing Co., Ltd.
InventorMasaaki Kanae
Life of this patent
Estimating the term…
Abstract
Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate 2, a driver portion 3 formed on one of the principle surfaces of the device substrate 2, a protection portion 4 configured to cover the driver portion 3 so as to form a hollowed space 8 around the driver portion 3, an adhesion layer 10 that is made of a resin and arranged above the protection portion 4, and a reinforcing plate 11 arranged on the adhesion layer 10, wherein the reinforcing plate 11 is a silicon substrate.
Claims6
An electronic component comprising:
- a device substrate,
- a driver portion on one of principle surfaces of the device substrate,
- a protection portion configured to cover the driver portion so as to define a hollowed space around the driver portion,
- an adhesion layer made of a resin and arranged above the protection portion, and
- a reinforcing plate on the adhesion layer,
- wherein the reinforcing plate is a silicon substrate including a circuit board.
Dependencies are inferred from the claim text.