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US 10,593,855 B2Granted
Fully integrated thermoelectric devices and their application to aerospace de-icing systems
OwnerL. Pierre de Rochemontinventor
Life of this patent
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Abstract
A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers, and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.
Claims12
A thermoelectric module comprising:
- an integrated, layered structure comprising:
- first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers;
- and
- an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit,
- wherein the semiconducting elements have a polycrystalline microstructure with polycrystalline grain sizes that are less than 100 nm, and
- wherein the elements of the array are separated by amorphous silica.
3 more elements
Dependencies are inferred from the claim text.