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US 10,593,851 B2Granted
Metal powder sintering paste, method for producing the same, and method for producing conductive material
AssigneeNichia Corporation
InventorsTeppei Kunimune, Masafumi Kuramoto
Life of this patent
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Abstract
Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 μm to 5 μm as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.
Claims19
A metal powder sintering paste,
- comprising silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm as a main component,
- further comprising inorganic spacer particles having a coefficient of variation (CV) value (a standard deviation/an average value) of less than 5%, and
- comprising substantially no resin, and
- wherein the inorganic spacer particles have an average particle diameter (a medium diameter) of 10 to 60 μm.
1 more element
A metal powder sintering paste,
- comprising silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm as a main component,
- further comprising inorganic spacer particles having a coefficient of variation (CV) value (a standard deviation/an average value) of less than 5%,
- comprising substantially no resin, and
- wherein the silver particles contain particles having an average particle diameter (a median diameter) of less than 0.3 μm in an amount of 5 mass % or less.
1 more element
A metal powder sintering paste,
- comprising silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm as a main component,
- further comprising inorganic spacer particles having a coefficient of variation (CV) value (a standard deviation/an average value) of less than 5%,
- comprising substantially no resin, and
- wherein an electric resistance of a conductive material achieved by sintering the metal powder sintering paste is 6 μΩ·cm or less.
1 more element
Dependencies are inferred from the claim text.