Method for manufacturing light emitting diode package

A method of manufacturing a light emitting diode package, comprising:

• disposing a first solder between a first connection pad of a substrate and a first pad electrode of a light emitting diode and disposing a second solder between a second connection pad of the substrate and a second pad electrode of the light emitting diode;
• and performing heat treatment on the first and second solders to bond the substrate to the light emitting diode, wherein the heat treatment of the first and second solders comprises:
• heating the first and second solders from room temperature to a temperature TP;
• maintaining the first and second solders at the temperature TP;
• and cooling the first and second solders from the temperature TP, and wherein heating the first and second solders comprises:
• a first ramping step in which a temperature of the first and second solders is raised from room temperature to a temperature TA at a constant heating rate;
• a preheating step in which the temperature of the first and second solders is raised from the temperature TA to a temperature TB to impart flowability to the first and second solders, wherein the preheating step comprises a preheating zone in which a heating rate varies over time;
• and a second ramping step in which the temperature of the first and second solders is raised from the temperature TB to a temperature TL at a constant heating rate, the preheating step being performed for 60 seconds to 180 seconds.