Semiconductor light-emitting device, method for producing same, and display device

A LED package comprising:

• a first lead that includes a first portion and a second portion, the first portion having an obverse surface and a reverse surface, the second portion connected to the first portion, the second portion having an obverse surface and a reverse surface, the obverse surface of the second portion being flush with the obverse surface of the first portion, the second portion being smaller in size in a first direction perpendicular to the obverse surface of the first portion than the first portion;
• a LED chip electrically connected to the first lead and disposed on the obverse surface of the first lead;
• a second lead that is spaced from the first lead in a second direction parallel to the obverse surface of the first portion and includes a third portion and a fourth portion, the third portion having an obverse surface and a reverse surface, the fourth portion connected to the third portion, the fourth portion protruding from the third portion toward the second portion, the fourth portion having an obverse surface and a reverse surface, the fourth portion being smaller in size in the first direction than the third portion;
• a die-bonding portion that covers a part of a first surface of the first lead;
• a wire that connects the LED chip and the second lead to each other;
• and
• a sealing resin that covers the obverse surface and reverse surface of the second portion, the obverse surface of the first portion, the obverse surface and reverse surface of the fourth portion, the obverse surface of the third portion, the LED chip and the wire, the sealing resin exposing the reverse surface of the first portion and the reverse surface of the third portion, wherein the second portion is greater in length in the second direction than each of the fourth portion and the LED chip, and the first lead and the second lead respectively have a first buried surface and a second buried surface in the sealing resin,
• the first lead has a first curved surface that connects the reverse surface of the second portion and the first portion to each other, the first curved surface being held in contact with the sealing resin, the first curved surface having a first curvature radius, and
• the second lead has a second curved surface that connects the reverse surface of the fourth portion and the third portion to each other, a part of the sealing resin being located between the first curved surface and the second curved surface, the second curved surface being held in contact with the sealing resin, the second curved surface having a second curvature radius that is different from the first curvature radius,
• wherein the first lead has a first drawn-out portion having flat side surfaces exposed from the sealing resin at the reverse surface of the first portion, and
• the second lead has a second drawn-out portion having flat side surfaces exposed from the sealing resin at the reverse surface of the third portion.