Manufacturing method of light-emitting device

A method of manufacturing a light-emitting device, comprising:

• providing a light-emitting diode wafer, comprising a substrate and a semiconductor stack on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface;
• providing a first laser on the light-emitting diode wafer and irradiating the light-emitting diode wafer from the upper surface to form a plurality of scribing lines on the upper surface;
• providing an etching process to clean the light-emitting diode wafer after providing the first laser;
• forming an electrode on the semiconductor stack after providing the first laser;
• providing and focusing a second laser on an interior of the substrate to form one or a plurality of textured areas in the substrate;
• and
• providing force on the light-emitting diode wafer to separate the light-emitting diode wafer into a plurality of light-emitting diode chips along the plurality of scribing lines.