Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsTatsuya Nishiwaki, Kohei Oasa, Hiroshi Matsuba, Kikuo Aida, Hung Hung
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsTatsuya Nishiwaki, Kohei Oasa, Hiroshi Matsuba, Kikuo Aida, Hung Hung
Estimating the term…
A semiconductor device according to an embodiment includes: a first semiconductor region of a first conductive type; a base region of a second conductive type; gate electrodes penetrating through the base region to reach the first semiconductor region; gate insulating films around the plurality of gate electrodes; a first region having a source region of the first conductive type, among a plurality of regions between the plurality of gate insulating films; a second region not having the source region among the plurality of regions, the second region being located in a terminal region of the first region; a first contact of a first width in the first region and electrically connecting the base region and a source electrode; and a second contact of a second width larger than the first width, the second contact being in the second region and electrically connecting the base region and the source electrode.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.