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US 10,593,656 B2Granted
Three-dimensional package structure
AssigneeCyntec Co., Ltd.
InventorsDa-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
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Abstract
The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
Claims5
An electronic module, comprising:
- a substrate;
- a plurality of electronic devices, disposed on the substrate;
- a unitary packaging body, encapsulating the plurality of first electronic devices and at least one portion of the substrate, and a first pin and a second pin are disposed on and in contact with the unitary packaging body;
- and
- an energy storage element, comprising a magnetic body and a coil disposed inside the magnetic body, wherein a first electrode and a second electrode of the energy storage element are disposed on the magnetic body, wherein the magnetic body is disposed over the unitary packaging body with the first electrode and the second electrode being electrically connected to and in contact with the first pin and the second pin, respectively.
2 more elements
Dependencies are inferred from the claim text.