Packaged integrated circuit devices with through-body conductive vias, and methods of making same

A device, comprising:

• a first group of embedded die and a second group of embedded die vertically aligned with the first group, wherein each of the first and second groups of embedded die comprise a vertically-aligned plurality of individual embedded die, each of the individual embedded die comprise an integrated circuit die and a body of encapsulant material, and each integrated circuit die has a back side that is embedded in the body of encapsulant material and a front side that is generally flush with an outermost surface of the first group or the second group of embedded die;
• at least one first conductive via that extends through the first group of embedded die;
• at least one second conductive via that extends through the second group of embedded die;
• and
• at least one conductive structure positioned between the first and second groups of embedded die that provides an electrically conductive flow path between the first and second conductive vias.