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US 10,593,650 B2Granted
Method and device for controlling operation using temperature deviation in multi-chip package
AssigneeSamsung Electronics Co., Ltd.
InventorMin-Sang Park
Life of this patent
Estimating the term…
Abstract
A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m<n) bits based on temperature information of n bits produced by the temperature sensors. The first die provides the temperature deviation information of m bits rather than the temperature information of n bits to the second die. An internal operation of the second die is controlled using the temperature deviation information output by the first die.
Claims5
A memory device comprising:
- a first die including a first temperature sensor configured to generate first temperature information and a temperature deviation calculator configured to generate temperature deviation information based on the first temperature information;
- a second die including a first memory cell array, and a first temperature compensation calculator configured to receive the temperature deviation information and to generate first temperature compensation information based on the temperature deviation information;
- a third die including a second memory cell array, a second temperature compensation calculator configured to receive the temperature deviation information and to generate second temperature compensation information based on the temperature deviation information;
- and
- a through silicon via (TSV) electrically connecting the first die, the second die and the third die,
- wherein the temperature deviation information is provided to the second die and the third die from the first die via the TSV.
3 more elements
Dependencies are inferred from the claim text.