Semiconductor device

A semiconductor device comprising:

• a base member;
• a stacked body placed on the base member, the stacked body including a plurality of memory chips and a shared terminal, the plurality of memory chips being stacked in a direction crossing a top surface of the base member, the shared terminal being connected to the plurality of memory chips and extending in the direction the plurality of memory chips being stacked;
• a first conductor provided on a top surface of the stacked body, the first conductor being provided on a back surface of an uppermost memory chip of the plurality of memory chips;
• a second conductor provided on the top surface of the base member, the second conductor being electrically connected to a front surface of a lowermost memory chip of the plurality of memory chips;
• and
• a connection conductor connecting the first conductor and the second conductor,
• the stacked body further including an insulating film provided on the back surface of the uppermost memory chip, the first conductor being connected to the shared terminal through a contact hole provided in the insulating film,
• the shared terminal having a top end positioned at the top surface of the stacked body and a bottom end positioned at a bottom surface of the stacked body,
• the first conductor being connected to a top end of the shared terminal, the second conductor being electrically connected to a bottom end of the shared terminal.