Back to results
US 10,593,648 B2Granted
Heart transfer label structure
AssigneeSamsung Electronics Co., Ltd.
InventorsIlsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
Claims19
A heat transfer label structure, comprising:
- a heat conduction layer having a first surface and an opposite second surface;
- and
- a label on the heat conduction layer,
- wherein the label comprises:
- a facestock layer having a first surface facing toward the first surface of the heat conduction layer and an opposite second surface;
- a first ink pattern on the second surface of the facestock layer;
- and
- an adhesive film interposed between the facestock layer and the first surface of the heat conduction layer,
- wherein the facestock layer of the label is interposed between the first ink pattern and the heat conduction layer, and
- wherein a heat conducting material of the heat conduction layer extends over an entirety of the first surface of the facestock layer through the adhesive film.
7 more elements
A heat transfer label structure, comprising:
- a label comprising a facestock layer having a first surface and an opposite second surface, and ink patterns on the first surface of the facestock layer;
- a heat conduction layer of copper having a thickness of between 25 micrometers and 50 micrometers;
- and
- an adhesive film interposed between the heat conduction layer and the second surface of the facestock layer, the adhesive film fixing the facestock layer to the heat conduction layer,
- wherein the heat conduction layer has a higher thermal conductivity than the label, and
- wherein the heat conduction layer comprises a first surface facing the adhesive film, a first side surface, a second side surface opposite to the first side surface, a third side surface neighboring to the first side surface, and a fourth side opposite to the third side surface,
- wherein the first side surface, the second side surface, the third side surface, and the fourth side surface of the heat conduction layer contact edges of the first surface, respectively, and
- wherein the first surface of the heat conduction layer completely overlaps an area surrounded by the first side surface, the second side surface, the third side surface, and the fourth side surface in a plan view.
5 more elements
A heat transfer label structure, comprising:
- a heat conducting structure comprising a plurality of thermally conductive layers stacked one on another and a respective adhesive layer interposed between adjacent ones of each respective pair of the thermally conductive layers;
- and
- a label on the heat conducting structure,
- wherein the label comprises:
- a facestock layer having a first surface facing toward the heat conducting structure and an opposite second surface;
- an adhesive film interposed between the first surface of the facestock layer and the heat conducting structure and by which the label is fixed to the heat conducting structure;
- and
- a layer of ink markings on the second surface of the facestock layer, whereby the facestock layer is interposed between the layer of ink markings and the adhesive film,
- wherein each of the thermally conductive layers has a thermal conductivity greater than that of the label.
6 more elements
Dependencies are inferred from the claim text.