Package structure and manufacturing method thereof

A package structure, comprising:

• a first package, wherein the first package comprises:
• a semiconductor die having an active surface and a back surface;
• an insulating encapsulant encapsulating the semiconductor die and having a top surface and a bottom surface opposite to the top surface;
• a first redistribution layer disposed on the back surface of the semiconductor die and the bottom surface of the insulating encapsulant, the first redistribution layer having a first surface and a second surface opposite to the first surface;
• a second redistribution layer disposed on the active surface of the semiconductor die and having a third surface;
• a plurality of first conductive wire segments, wherein each of the first conductive wire segments consisting of:
• a first segment having a first extending direction substantially perpendicular to the third surface, the first segment being directly connected to the second redistribution layer;
• and
• a first stud bonded to the semiconductor die, wherein the first stud is directly connected to the first segment;
• a plurality of second conductive wire segments, wherein each of the second conductive wire segments consisting of:
• a second segment having the first extending direction, the second segment being directly connected to the second redistribution layer;
• and
• a second stud bonded to the first redistribution layer, wherein the second stud is directly connected to the second segment, wherein a terminal portion of the first segment, a terminal portion of the second segment, a top surface of the insulating encapsulant, and the third surface of the second redistribution layer are coplanar;
• and
• a second package, stacked on the second surface of the first redistribution layer over the first package;
• wherein the first redistribution layer comprises:
• a plurality of conductive elements;
• and
• a dielectric layer, disposed on the plurality of conductive elements and having a plurality of openings to expose a portion of the plurality of conductive elements, wherein the plurality of second studs are embedded within the plurality of respective openings to be directly connected to the plurality of respective conductive elements.