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US 10,593,644 B2Granted
Apparatus for assembling devices
AssigneeIndustrial Technology Research Institute
InventorsChin-Hung Wang, Yu-Wei Huang
Life of this patent
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Abstract
An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.
Claims7
A device assembling system, comprising:
- a plurality of actuated devices is disposed on a surface of a substrate in a manner of array, wherein each of the actuated devices comprising:
- a first electrode disposed on and in contact with the surface of the substrate and electrically connected to the substrate;
- a connecting pad disposed on and in contact with the surface of the substrate;
- an electroactive material layer comprising a first surface and a second surface, wherein an end of the first surface is directly connected to the first electrode, and another end of the first surface is directly connected to the connecting pad;
- and
- a second electrode disposed on the second surface of the electroactive material layer, and electrically connected to the substrate.
3 more elements
Dependencies are inferred from the claim text.