Flip chip integrated circuit packages with spacers

An apparatus, comprising:

• a lead frame having a die mount area on a first surface and having lock structures extending from the first surface into the lead frame;
• and
• a semiconductor substrate having an active surface, further comprising:
• at least two pillars on bond pads on the active surface of the semiconductor substrate, the at least two pillars extending away from the active surface and having solder material disposed on ends of the at least two pillars to form at least two pillar bumps;
• and
• at least one spacer of a single metal extending from the active surface of the semiconductor substrate at a predetermined distance from the active surface of the semiconductor substrate and having a spacer end;
• wherein the semiconductor substrate, the at least two pillar bumps and the at least one spacer are flip chip mounted to the die mount area of the lead frame, the solder material forming solder joints between the first surface of the lead frame and the at least two pillar bumps, and the spacer end and a portion of the at least one spacer is positioned in a selected one of the lock structures extending into the lead frame.