Metal pad modification
AssigneeInternational Business Machines Corporation
InventorsKrishna Tunga, Ekta Misra
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Abstract
The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.
Claims1
A structure comprising:
- a base material;
- at least one metal pad,
- wherein a first surface of the metal pad is in contact with a surface of the base material,
- wherein the metal pad is deposited within the base material;
- a metal pedestal,
- wherein a first surface of the metal pedestal is in contact with a second surface of the metal pad,
- wherein a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material,
- wherein the offset distance ranges from 0 μm to 20 μm,
- wherein a first dimension of the metal pad is smaller than a second dimension of the metal pad,
- wherein the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material,
- wherein the first dimension is parallel to the line running from the center of the metal pad to the center axis of the base material,
- wherein an aspect ratio of the second dimension to the first dimension is greater than 1:1 and less than 2:1;
- and
- a solder bump in contact with a second surface of the metal pedestal;
- a passivation layer between the metal pedestal and the metal pad with a via in the passivation layer,
- wherein the metal pedestal contacts the metal pad through the via in the passivation layer,
- wherein the metal pedestal is deposited on the passivation layer and the second surface of the metal pad,
- wherein the passivation layer has a thickness ranging from 0 μm to 20 μm.
Dependencies are inferred from the claim text.