Packaged devices with integrated antennas
AssigneeAnalog Devices, Inc.
InventorsYoun-Jae Kook, Yeonsung Kim, Dipak Sengupta
Life of this patent
Estimating the term…
Abstract
Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.
Claims20
A packaged integrated device, comprising:
- a package body comprising a base and at least one side wall extending non-parallel from the base, the base and the at least one side wall disposed at least partially around a cavity;
- an integrated device die mounted to the base within the cavity of the package body;
- a plurality of radiating elements including a first radiating element, the first radiating element disposed along and integrated with the at least one side wall of the package body, the plurality of radiating elements disposed in different directions, the first radiating element of the plurality of radiating elements comprising a curved or angled portion and a plate portion, the first radiating element disposed along an exterior surface of the at least one side wall and generally parallel with the at least one side wall, the curved or angled portion disposed relative to the plate portion so as to define a concave outer surface of the radiating element;
- and
- a grounded element disposed along and integrated with the at least one side wall of the package body and positioned between at least one radiating element of the plurality of radiating elements and the integrated device die.
A packaged integrated device, comprising:
- a package body comprising a base and at least one side wall extending non-parallel from the base, the at least one side wall being integrally formed with the base;
- an integrated device die mounted to the base within the package body;
- an angled or curved radiating element disposed along and integrated with an exterior surface of the at least one side wall of the package body, the angled or curved radiating element comprising a plate portion generally parallel with the at least one side wall and an angled or curved portion extending outwardly from the plate portion to define a concave outer surface of the angled or curved radiating element;
- and
- a grounded element disposed along and integrated with the at least one side wall of the package body and positioned between the angled or curved radiating element and the integrated device die.
A packaged integrated device, comprising:
- a package body comprising a base and at least one side wall extending non-parallel from the base, the at least one side wall disposed at least partially around a cavity;
- an integrated device die mounted to the base within the cavity of the package body, the integrated device die and the at least one side wall being laterally spaced apart;
- a plurality of radiating elements, the plurality of radiating elements comprising a first angled or curved radiating element disposed along an exterior surface of the at least one side wall of the package body, the plurality of radiating elements disposed in different directions, the first angled or curved radiating element including a plate portion generally parallel with the at least one side wall and an extension from the plate portion to define a concave outer surface of the radiating element;
- and
- a grounded element disposed along the at least one side wall of the package body and positioned between at least one radiating element of the plurality of radiating elements and the integrated device die.
Dependencies are inferred from the claim text.