US 10,593,633 B2 · Semiconductor module

Abstract

It is an object of the present invention to provide a semiconductor module which suppresses a break in a current path and occurrence of arc discharge when a semiconductor chip is short-circuited. A semiconductor module 100 according to the present invention includes at least one semiconductor chip 2, a housing 5 in which the semiconductor chip 2 is stored, and at least one pressurizing member which is placed between an upper electrode 2a of the semiconductor chip 2 and an upper-side electrode 3 provided in the housing 5 and electrically connects the upper electrode 2a and the upper-side electrode 3, the pressurizing member 10 is elastic, and the pressurizing member 10 includes a conductive block 12 and a plate spring member 11 including current paths 11a and 11b which are opposed to each other with at least a part of the conductive block 12 located between the current paths 11a and 11b.

Claims14

Dependent claims

A semiconductor module comprising:

at least one semiconductor chip;
a housing in which the semiconductor chip is stored;
and
at least one pressurizing member being placed between an upper electrode of the semiconductor chip and an upper-side electrode provided in the housing, the pressurizing member being configured to electrically connect the upper electrode and the upper-side electrode, wherein
the pressurizing member is elastic,
the pressurizing member includes:
a conductive block;
and
a plate spring member including current paths that are opposed to each other with at least a part of the conductive block located between the current paths,
the plate spring member has an annular shape,
an upper portion of the annular plate spring member is in contact with the upper-side electrode of the housing,
a lower portion of the annular plate spring member is in contact with the upper electrode of the semiconductor chip, and
the conductive block is placed to be in contact with an inner wall of the annular plate spring member.

10 more elements

A semiconductor module comprising:

at least one semiconductor chip;
a housing in which the semiconductor chip is stored;
and
at least one pressurizing member being placed between an upper electrode of the semiconductor chip and an upper-side electrode provided in the housing, the pressurizing member being configured to electrically connect the upper electrode and the upper-side electrode, wherein
the pressurizing member is elastic,
the pressurizing member includes:
a conductive block;
and
a plate spring member including current paths that are opposed to each other with at least a part of the conductive block located between the current paths,
the plate spring member has a U-shape,
a bottom portion of the U-shaped plate spring member is in contact with the upper-side electrode of the housing,
the conductive block is in contact with the U-shaped plate spring member while being sandwiched between portions of the U-shaped plate spring member, and
a surface of the conductive block, the surface being located near the semiconductor chip, is in contact with the upper electrode of the semiconductor chip.

10 more elements

Dependencies are inferred from the claim text.

Semiconductor module

Life of this patent

Semiconductor module

Life of this patent

Abstract

Claims14